Panel encapsulation : flip cob
Pixel pitch: 0.7/0.9/1.25/1.56
Unit size: 600(L) x337. 5 (W)mm
Aspect ratio: 16:9
Flip cob products adopt full flip light-emitting chip and solderless encapsulation process. The light-emitting chip is directly bonded with the pad of PCB board. The welding is from point to surface, the welding area is increased, the solder joints are reduced, and the product performance is more stable. The packaging layer does not need wire space, and the packaging layer is lighter and thinner, which reduces the thermal resistance, improves the light quality and improves the service life of the display screen. Ultra high protection, anti-collision, shockproof, waterproof, dustproof, salt fog and static electricity.
20000:1 ultra high contrast, darker black field, brighter brightness and higher contrast. Support HDR digital image technology, with fine and perfect static and high dynamic image quality. The first point by point consistent correction technology can realize accurate acquisition and brightness chromaticity correction, and the uniformity is more than 97%.
No pixel graininess; It can effectively control the brightness of the pixel center, reduce the light intensity radiation, inhibit the moire pattern, and avoid the damage of glare to the retina. It is suitable for close distance and long time viewing, and is not easy to produce visual fatigue.
2K / 4K / 8K resolution unlimited size free splicing, suitable for large scene display. It has good visual angle and side view display uniformity, and no color bias under large viewing angle, which can reach a viewing angle of 170°.
Full flip chip, under the same brightness condition, the power consumption is reduced by 30%. The amorphous area formed by the packaging structure can be covered with black light absorbing material. This makes Jiuzhou flip COB products better in comparison effect. The unique low-heat generation technology reduces the surface temperature of the screen by 30% compared with the conventional display, which is more suitable for the application scenarios of near-screen experience.
Widely used in government, schools, communities, libraries, state-owned enterprises, private enterprises, institutions and other fields